EFFECT OF MOISTURE ON SEEDLING STAGE OF SOYBEAN (GLYCINE MAX)
Journal: Plant Physiology and Soil Chemistry
Author: Rajesh Neupane, Sandip Panth, Sabina Aryal, Bandana Khanal
This is an open access article distributed under the Creative Commons Attribution License CC BY 4.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
The research was conducted at Rampur Campus, Khairahani, Nepal to analyze the effect of moisture on different soybean (Glycine max) genotypes under a partially controlled environment. The experiment was carried out in a Completely Randomized Design (CRD) with 16 distinct genotypes and 3 water levels (waterlogged, control and drought) as treatment and replicated with 3 times. Various parameters including germination percentage, plant mortality, plant height, number of leaves, and number of branches were measured at different stages of growth. The results showed that genotypes SBO122 and TGX1891116FN exhibited early germination with the highest germination percentage recorded at 5 days after sowing (DAS). TGX1891116FN showed the highest germination percentage of 100% at 15 DAS. However, the germination percentages were lower in other genotypes, which could be attributed to the lower temperatures during the research period. The mortality rate of soybean seedlings varied among genotypes and moisture treatments. Genotype CM9125 showed the highest mortality rate of 100%, followed by Puja and GC8234GC-13 with a mortality rate of 88.87%. Plant height was significantly affected by different genotypes and moisture treatments. Under normal conditions, genotype Puja exhibited the highest plant height at 20 DAS, while under waterlogging conditions, TGX1989-19F had the highest height. Drought conditions also affected plant height, with genotype GC8234GC13 showing the highest height at 30 DAS. These findings can contribute to the development of soybean varieties that are resistant to moisture stress and improve soybean production in Nepal.